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| 化学镀镍中铜被腐蚀的机制及其对策 | |
| 引用本文： | 夏承钰. 化学镀镍中铜被腐蚀的机制及其对策[J]. 腐蚀与防护, 1997, 18(6): 19-21 |
| 作者姓名： | 夏承钰 |
| 作者单位： | 西安理工大学 西安710048 |
| 摘 要： | 分析了化学镀镍槽液引起铜腐蚀和导致化学镀镍过程中障碍的机制，并提出了相应对策。 |
| 关 键 词： | 化学镀 铜腐蚀 镀镍 电镀 镀液 |
ANALYSIS OF THE COPPER CORROSION MECHANISM DURING THE ELECTROLESS DEPOSIT OF Ni AND A COUNTERMEASURE |
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| Xia Chengyu. ANALYSIS OF THE COPPER CORROSION MECHANISM DURING THE ELECTROLESS DEPOSIT OF Ni AND A COUNTERMEASURE[J]. Corrosion & Protection, 1997, 18(6): 19-21 | |
| Authors: | Xia Chengyu |
| Abstract: | The copper corrosion mechanism which is resulted from the electroless deposit Ni bath solution and the mechanism which leads to a hitch in the process for electroless deposit Ni are analyzed. A countermeasure to overcome these problems is put forward in the present paper. |
| Keywords: | Electroless deposit Ni Bath solution Copper corrosion |
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