| 降低金属-陶瓷场致扩散连接中残余应力的措施 |
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| 引用本文： | 刘子建,王久海,刘翠荣,孟庆森.降低金属-陶瓷场致扩散连接中残余应力的措施[J].稀有金属与硬质合金,2007,35(3):58-60. |
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| 作者姓名： | 刘子建 王久海 刘翠荣 孟庆森 |
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| 作者单位： | 1. 太原科技大学,山西,太原,030024
2. 太原理工大学,山西,太原,030024 |
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| 摘 要： | 简要介绍了场致扩散连接的机理、特点及应用，指出了残余应力的存在对键合质量的影响。在分析金属一陶瓷场致扩散连接中残余应力产生原因的基础上，给出了降低这些因素影响的具体措施。
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| 关 键 词： | 金属-陶瓷 场致扩散连接 残余应力 键合质量 工艺措施 |
| 文章编号： | 1004-0536（2007）03-0058-03 |
| 修稿时间： | 2007-04-16 |
The Measures of Lowing Residual Stress from Metal-Ceramic Field Diffusion Bonding |
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| LIU Zi-jian,WANG Jiu-hai,LIU Cui-rong,MENG Qing-sen.The Measures of Lowing Residual Stress from Metal-Ceramic Field Diffusion Bonding[J].Rare Metals and Cemented Carbides,2007,35(3):58-60. |
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| Authors: | LIU Zi-jian WANG Jiu-hai LIU Cui-rong MENG Qing-sen |
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| Affiliation: | 1. Taiyuan University of Science and Technology, Taiyuan 030024,China ; 2. Taiyuan University of Technology, Taiyuan 030024, China |
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| Abstract: | This paper describes the mechanism, characteristics and applications of field diffusion connection. It is pointed out that the presence of residual stress can affect the bonding quality. Based on the analysis on how the residual stress is generated from metal-ceramic filed diffusion bonding,detailed measures are given to lower the influence. |
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| Keywords: | metal-ceramic field diffusion bonding residual stress bonding quantity technological measures |
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