热固性树脂半固化片树脂流动度研究

采用聚丁二烯、丙酮、陶瓷粉填料和其他助剂,制得胶液,用偶联剂处理过的玻璃布在胶液中浸渍后,在70℃干燥脱溶剂,在140℃继续烘烤10 min,得到半固化状态的预浸片。将浸渍片按固定的尺寸裁切后即得到所需的热固性树脂半固化片。对半固化片关键指标之一的树脂流动度的影响因素及调控方法进行了较为详细的讨论。结果表明,在良好界面改性的同时,当陶瓷粉配比中球角比越小、烘道温度越高时,半固化片的树脂流动度越低,相反则流动度越大,流动度调整范围可从0.7%到20.5%。通过对相关影响因子的合理调控,就能得到满足不同使用要求的半固化片,满足不同情况下多层板的设计加工要求。

Study on Resin Fluidity of Thermosetting Resin Prepreg

By using polybutadiene,acetone,ceramic powder filler and other additives,the prepreg was prepared.After dipping the glass cloth treated with coupling agent in the glue,the prepreg was dried and desolved at 70℃and baked at 140℃for 10 min.The impregnated sheet is cut according to the fixed size to obtain the required thermosetting resin semi-cured sheet.The influencing factors and control methods of resin fluidity,one of the key indicators of prepreg,were discussed in detail.The results show that under good interface modification,the lower the ball angle ceramic powder ratio and the higher temperature are,the lower resin fluidity of the prepreg is.On the contrary,the higher resin fluidity is.The adjustment range of fluidity is from 0.7%to 20.5%.Through the reasonable control of the relevant influence factors,the prepreg to meet the requirements of different use was got,thus to meet the design and processing requirements of multilayer board under different conditions.