| 一种软钎焊料润湿角的测量方法 |
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| 引用本文： | 钱国统,薛建平,刘洪森,张强,冯胜.一种软钎焊料润湿角的测量方法[J].电子元件与材料,2008,27(2):65-66. |
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| 作者姓名： | 钱国统 薛建平 刘洪森 张强 冯胜 |
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| 作者单位： | 绍兴市天龙锡材有限公司,浙江,绍兴,312001 |
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| 摘 要： | 采用数码摄影技术和AutoCAD软件,获得一种较为精确的软钎焊料润湿角测量方法。介绍了具体操作过程和应注意的事项。
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| 关 键 词： | 电子技术 数码摄影 AutoCAD 软钎焊料 润湿角 |
| 文章编号： | 1001-2028（2008）02-0065-02 |
| 收稿时间： | 2007-09-30 |
| 修稿时间： | 2007年9月30日 |
A method for measuring wetting angle of solder |
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| QIAN Guo-tong,XUE Jian-ping,LIU Hong-sen,ZHANG Qiang,FENG Sheng.A method for measuring wetting angle of solder[J].Electronic Components & Materials,2008,27(2):65-66. |
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| Authors: | QIAN Guo-tong XUE Jian-ping LIU Hong-sen ZHANG Qiang FENG Sheng |
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| Affiliation: | QIAN Guo-tong,XUE Jian-ping,LIU Hong-sen,ZHANG Qiang,FENG Sheng (Shaoxing Tianlong Tin Materials Co. Ltd.,Shaoxing 312000,Zhejiang Province,China) |
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| Abstract: | A precise method for measuring wetting angle of solders was discussed by the digital photography and AutoCAD software. The detailed operation and some important points in the measurement were indicated. |
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| Keywords: | electron technology digital photography AutoCAD solder wetting angle |
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