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交流量热法测量SiO2薄膜的热扩散率
引用本文:陈海军,马灵芝,唐祯安.交流量热法测量SiO2薄膜的热扩散率[J].功能材料,2002,33(5):539-541.
作者姓名:陈海军  马灵芝  唐祯安
作者单位:大连理工大学,电子系,辽宁,大连,116023
基金项目:国家重大自然科学基金资助项目(59995550-5)
摘    要:介绍了交流量热法测量薄膜热扩散率的原理和系统组建,用脉宽为纳秒级的超短激光脉冲作为热源,测量了Si衬底上厚度为100nm和500nm的SiO2薄膜水平方向上的热扩散率,实验结果表明该结构的热扩散率比SiO2体材料的要小,并且随着SiO2层厚度的减小,热扩散率也减少。

关 键 词:交流量热法  测量  SiO2薄膜  热扩散率
文章编号:1001-9731(2002)05-0539-03
修稿时间:2001年11月8日

Measurement of thermal diffusivity of SiO2 thin films using AC calorimetric method
CHEN Hai-jun,MA Ling zhi,TANG Zhen an.Measurement of thermal diffusivity of SiO2 thin films using AC calorimetric method[J].Journal of Functional Materials,2002,33(5):539-541.
Authors:CHEN Hai-jun  MA Ling zhi  TANG Zhen an
Abstract:This paper describes the principle and experiment setup of AC calorimetric method for measuring thermal diffusivity of SiO 2 thin films. In the experiment, a laser source that the pulse duration was in the range of nanoseconds was used to heat up the samples. Using AC calorimetric method, the inplane thermal diffusivities of SiO 2 thin films with the thickness of 100nm and 500nm were measured, respectively. The results show that the thermal diffusivity of the thin film was smaller than its corresponding bulk material, and with the decreasing of the film thickness, the thermal diffusivity also decreasing.
Keywords:AC calorimetric method  thin films  thermal diffusivity
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