Deep-level trapping centers in heterostructures for GaN field-effect transistors |
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Authors: | M. S. Andreev L. E. Velikovskii T. S. Kitichenko T. G. Kolesnikova A. P. Korovin V. G. Mokerov S. N. Yakunin |
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Abstract: | Structural and electrophysical properties of heteroepitaxial gallium nitride layers on a sapphire substrate that are grown via the molecular beam epitaxy (MBE) method are studied. The parameters of deep-level trapping centers are determined by the method of the thermostimulated capacitor discharge; the degree of perfection of the film and substrate are determined by the two-crystal X-ray spectrometry method. The following structures are studied: i-GaN (1–2 µm)/GaN 〈Si〉(0.1?0.4 µm) and multilayer structures (Al0.3Ga0.7N-GaN-Al0.3-Ga0.7N-GaN-Al2O3) grown via the MBE method on a sapphire substrate. The effect of reactive ion etching on the energy spectrum of deep-level trapping centers in gallium nitride is studied. The obtained results are used to calculate the energy spectrum of defects in gallium nitride structures. |
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