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Deep-level trapping centers in heterostructures for GaN field-effect transistors
Authors:M. S. Andreev  L. E. Velikovskii  T. S. Kitichenko  T. G. Kolesnikova  A. P. Korovin  V. G. Mokerov  S. N. Yakunin
Abstract:Structural and electrophysical properties of heteroepitaxial gallium nitride layers on a sapphire substrate that are grown via the molecular beam epitaxy (MBE) method are studied. The parameters of deep-level trapping centers are determined by the method of the thermostimulated capacitor discharge; the degree of perfection of the film and substrate are determined by the two-crystal X-ray spectrometry method. The following structures are studied: i-GaN (1–2 µm)/GaN 〈Si〉(0.1?0.4 µm) and multilayer structures (Al0.3Ga0.7N-GaN-Al0.3-Ga0.7N-GaN-Al2O3) grown via the MBE method on a sapphire substrate. The effect of reactive ion etching on the energy spectrum of deep-level trapping centers in gallium nitride is studied. The obtained results are used to calculate the energy spectrum of defects in gallium nitride structures.
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