集成电路封装用GNPs/CNTs/HDPE导热高分子复合材料的研究

本文以高密度聚乙烯(HDPE)为基体,以自制的h-G-C-2/1体系杂化填料为导热填料,制备了GNPs/CNTs/HDPE导热高分子复合材料,重点对比了杂化填料和复配填料对GNPs/CNTs/HDPE复合材料在导热、导电及力学性能方面的影响。结果表明,GNPs/CNTs/HDPE导热高分子复合材料的拉伸强度为31.9 MPa,冲击强度为22.1 kJ/m^2,体积电阻率为690 MΩ·cm,热导率为0.759 W/(m·K),满足集成电路封装用技术参数要求。杂化填料的分散性优于复配填料,杂化填料在提高复合材料的拉伸性能方面优于复配填料,复配填料在提高复合材料的热导率方面优于杂化填料。本文所获得的研究成果为制备新型综合性能优异的集成电路封装用导热高分子复合材料提供了一条新的思路。

Study on GNPs/CNTs/HDPE Thermal Conductive Polymer Composite for Integrated Circuit Packaging

GNPs/CNTs/HDPE conductive polymer composite had been prepared by constructing high density polyethylene (HDPE) matrix and h-G-C-2/1 thermal conductive filler.Properties including thermal conductivity,electronic conductivity and mechanical strength were compared and studied.The composite shows good tensile strength (31.9MPa),impact strength (22.1 kJ/m2),volume resistivity (690 MΩ· cm) and thermal conductivity 0.759 W/(m· K)],which met the technical parameter requirements for integrated circuit package.The dispersion property and mechanical strength of hybrid filler were better than that of composite filler.The thermal conductivity of the composite was better than hybrid filler.Polymer composite material provides a new way for the preparation of integrated circuit package model with excellent performance.