Si-Al电子封装材料粉末冶金制备工艺研究

采用粉末冶金液相烧结工艺制备了Si-50％Al（质量分数)电子封装材料。研究了压制压力、烧结工艺对材料微观组织及性能的影响。结果发现：低温烧结时，随压制压力增大，材料密度呈上升趋势，而高温烧结时，材料密度较高且变化不大；增大压制压力不仅提高了材料的致密度，而且改善了界面接触方式，在一定范围内使得材料热导率提高，但压制压力过大时，则会导致Si粉出现大量的微裂纹等缺陷，界面热阻急剧上升，从而降低热导性能；适当提高烧结温度和延长烧结时间可以提高材料的热导率。

PM Process of Si-Al Electronic Packaging Materials

Si 50%Al (mass fraction) electronic packaging materials were fabricated by liquid phase sintering. The effects of pressure and sintering process on the microstructure and properties of the materials were investigated. The results show that density of the alloy increases with increased pressure at low sintering temperature, while is high and changes little at high sintering temperature. Thermal conductivity of the alloy increases with pressure as a result of improvements of densities and interface bonding, but too high pressure can lead to many microcracks in Si particles, and then lower thermal conductivities. Proper sintering temperature and sintering time can contribute to the improvement of the alloy thermal properties.