| P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响 |
| |
| 引用本文： | 陆裕东,何小琦,恩云飞,王 歆,庄志强.P对Au/Ni/Cu焊盘与SnAgCu焊点焊接界面可靠性的影响[J].稀有金属材料与工程,2009,38(3):477-480. |
| |
| 作者姓名： | 陆裕东 何小琦 恩云飞 王 歆 庄志强 |
| |
| 作者单位： | 1. 华南理工大学,特种功能材料教育部重点实验室,广东,广州,510640;信息产业部电子第五研究所,广东,广州,510610;华南理工大学,特种功能材料教育部重点实验室,广东,广州,510640;信息产业部电子第五研究所,广东,广州,510610
2. 华南理工大学,特种功能材料教育部重点实验室,广东,广州,510640;信息产业部电子第五研究所,广东,广州,510610 |
| |
| 基金项目： | 总装各部预研项目，信息产业部电子科技发展基金 |
| |
| 摘 要： | 采用回流焊工艺在ENIG镀层印制电路板上组装289I/Os无铅Sn-3.0Ag-0.5Cu球栅阵列封装器件,对封装后的电路板进行随机振动可靠性试验,采用X-Ray、SEM和EDX等测试确定焊点在随机振动试验过程中的失效机制,探讨焊点沿界面失效与镀层内P元素的分布和含量的关系.在振动试验中失效和未失效的BGA焊点与镀层界面表现出类似的微观形貌,Ni层因被氧化腐蚀而在焊点截面形貌上出现"缺齿"痕迹,而在表面形貌图上此呈现黑色的氧化腐蚀裂纹.P在镀层表面的聚集对Ni的氧化腐蚀有促进作用,同时P的聚集也明显降低焊点结合界面的机械强度.Ni层的氧化和Ni层表面P元素的聚集是引发焊点沿焊点,镀层结合界面开裂的主要原因.
|
| 关 键 词： | 化学镀镍浸金 镀层 回流焊工艺 |
| 收稿时间： | 2008/3/11 0:00:00 |
Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint |
| |
| Lu Yudong,He Xiaoqi,En Yunfei,Wang Xin and Zhuang Zhiqiang.Influence of Phosphorus on Reliability of Interface between Au/Ni/Cu Pad and SnAgCu Solder Joint[J].Rare Metal Materials and Engineering,2009,38(3):477-480. |
| |
| Authors: | Lu Yudong He Xiaoqi En Yunfei Wang Xin and Zhuang Zhiqiang |
| |
| Affiliation: | 1. Key Laboratory of Specially Functional Materials;Ministry of Education;South China University of Technology;Guangzhou 510640;China;2. The 5th Electronics Research Institute of the Ministry of Information Industry;Guangzhou 510610;China |
| |
| Abstract: | The content and distributing of P in Electroless Nickel/Immersion Gold (ENIG) surface finishes effect the reliability of interface between solder joint and surface finishes. 289 I/Os lead-free Sn-3.0Ag-0.5Cu BGAs was assembled on the ENIG print circuit board by reflow soldering technology. The print circuit board was tested by random vibration. After random vibration test, the failure and not failure samples were studied by X-ray, SEM, and EDX et al. The failure mechanism was confirmed and the relation of f... |
| |
| Keywords: | SnAgCu |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
| 点击此处可从《稀有金属材料与工程》浏览原始摘要信息 |
|
点击此处可从《稀有金属材料与工程》下载全文 |
|
