基体脉冲偏压对TiN/Cu纳米复合薄膜组织结构、力学及耐磨性能的影响

本文采用轴向磁场增强电弧离子镀在高速钢基体上沉积了TiN/Cu纳米复合薄膜,研究了基体脉冲偏压幅值对薄膜成分、结构、力学性能及耐磨性能的影响。结果表明,薄膜中铜含量随着脉冲偏压幅值的增加先增加而后降低,在一个较低的范围内(1.3-2.1at.%)。X射线衍射结果表明所有的薄膜均出现TiN相,并未观察到Cu相。薄膜的择优取向随着脉冲偏压幅值的增加而改变。薄膜的最高硬度为36GPa,是在脉冲偏压幅值为-200V时得到的,对应了1.6at.%的Cu含量。与纯的TiN薄膜相比,Cu的添加明显增强了薄膜的耐磨性能。

Effect of substrate pulse bias voltage on the microstructure and mechanical and wear-resistant properties of TiN/Cu nanocomposite films

In this present work, TiN/Cu nanocomposite films were deposited by axial magnetic field-enhanced arc ion plating (AMFE-AIP) on high-speed steel (HSS) substrates, and the effect of substrate bias voltage on the chemical composition, microstructure, mechanical and tribological properties of the films were investigated by X-ray photoelectrons spectroscopy (XPS), X-ray diffraction (XRD), nanoindentation and wear measurements, respectively. The results showed that Cu content firstly increases and then decreases with the increase of the pulse bias voltage, being a low value in the range of 1.3 to 2.1 at.%. The XRD results showed all the films only appear TiN phase and no Cu phase is observed. And the preferred orientation for the films changes significantly with increasing the pulse bias voltage. The maximum value of hardness, 36 GPa is obtained with pulse bias voltage of -200V corresponding to the film containing approximately 1.6 at.% Cu. Compared to pure TiN film, Cu addition to TiN films significantly improves the wear resistance.