首页 | 本学科首页   官方微博 | 高级检索  
     


Ohmic contacts formation of silicon schottky diodes by screen printing and rapid isothermal processing
Authors:D. Ratakonda  R. Singh  L. Vedula  S. Narayanan
Affiliation:(1) Micron Technology, Inc., 83707-0006 Boise, ID;(2) Department of Electrical and Computer Engineering Materials Science and Engineering Program, Clemson University, 29634-0915 Clemson, SC;(3) Level One Communications, 95827 Sacaramento, CA;(4) Solarex (A business unit of Amoco Enron Solar), 21703 Frederick, MD
Abstract:Rapid isothermal processing based on incoherent radiation as the source of optical and thermal energy is playing a major role in flexible fast-cycle time integrated circuits manufacturing. In this paper, we present the dark and illuminated current-voltage characteristics of silicon Schottky barrier diodes where the ohmic contacts are formed by screen printing and rapid isothermal annealing. These results are compared with evaporated contacts followed by furnace annealing or rapid isothermal annealing. In this paper, we have shown that the ohmic contacts formed by screen printing and rapid isothermal annealing are compatible with the contacts formed by evaporation process. The processing time of the screen printed ohmic contacts is significantly lower than the contacts formed by evaporation process.
Keywords:Cycle time  ohmic contacts  rapid isothermal processing (RIP)  Schottky barrier diodes  screen printing
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号