Ohmic contacts formation of silicon schottky diodes by screen printing and rapid isothermal processing |
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Authors: | D. Ratakonda R. Singh L. Vedula S. Narayanan |
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Affiliation: | (1) Micron Technology, Inc., 83707-0006 Boise, ID;(2) Department of Electrical and Computer Engineering Materials Science and Engineering Program, Clemson University, 29634-0915 Clemson, SC;(3) Level One Communications, 95827 Sacaramento, CA;(4) Solarex (A business unit of Amoco Enron Solar), 21703 Frederick, MD |
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Abstract: | Rapid isothermal processing based on incoherent radiation as the source of optical and thermal energy is playing a major role
in flexible fast-cycle time integrated circuits manufacturing. In this paper, we present the dark and illuminated current-voltage
characteristics of silicon Schottky barrier diodes where the ohmic contacts are formed by screen printing and rapid isothermal
annealing. These results are compared with evaporated contacts followed by furnace annealing or rapid isothermal annealing.
In this paper, we have shown that the ohmic contacts formed by screen printing and rapid isothermal annealing are compatible
with the contacts formed by evaporation process. The processing time of the screen printed ohmic contacts is significantly
lower than the contacts formed by evaporation process. |
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Keywords: | Cycle time ohmic contacts rapid isothermal processing (RIP) Schottky barrier diodes screen printing |
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