|
|||||
|
|
| 日本PCB基板材料业的市场转变与产品发展 | |
| 引用本文： | 祝大同. 日本PCB基板材料业的市场转变与产品发展[J]. 印制电路信息, 2003, 0(9): 15-19 |
| 作者姓名： | 祝大同 |
| 作者单位： | 北京远创铜箔设备有限公司,100009 |
| 摘 要： | 本文综述了日本PCB基板材料制造业根据市场的新变化,发展高性能、高附加值的基板材料的最新动向。 |
| 关 键 词： | 印制电路板 基板材料 覆铜板 |
Transformation of Market and Progress of Product about PCB Substrate Material in Japan |
|
| Zhu Datong. Transformation of Market and Progress of Product about PCB Substrate Material in Japan[J]. Printed Circuit Information, 2003, 0(9): 15-19 | |
| Authors: | Zhu Datong |
| Abstract: | Abstract In the paper, the recent transformation of market about PCB substrate manufacture in Japan was reviewed. At the same time, the newest development of high-performance and high profits substrate was introduced. |
| Keywords: | printed circuit board basis material copper clad laminate |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |