Ti/Cu扩散溶解层的组织结构和形成规律

采用镶嵌式扩散偶,在不同退火处理条件下,对Ti/Cu扩散溶解层进行了研究.利用扫描电子显微镜和电子探针显微分析仪观察和分析了扩散溶解层的组织结构和形成规律.结果表明,随着加热温度的升高和保温时间的延长,在Ti/Cu界面处会形成相界面依附于扩散偶组元Cu丝、形态各不相同、层数以及总层与单层厚度逐渐增加的"环状"扩散溶解层;当进行700℃、100小时真空退火热处理时,扩散溶解层厚度为93μm;其中一层呈"锯齿状"朝向Cu,分别有两层处于同一个层区域内,并以"竹笋状"方式互相交错重叠;结构为Cu/Cu4Ti/Cu2Ti/Cu3Ti2/Cu4Ti3/CuTi/CuTi2/Ti,而且其结构与Cu-Ti相图上各个相的左右排列顺序一致.不同的扩散温度和时间,Ti/Cu相界面处将几乎同时结晶出不同层数、厚度和结构的扩散溶解层.

Microstructure and forming rule of Ti/Cu diffusion solution zone

By using diffusion couple made by inlaying,the diffusion-solution zone of Ti/Cu was researched with different anneal condition.The microstructure and forming rule were observed and analysed by means of SEM and EDS.The results shown that the circularity diffusion-solution zone was formed at Ti/Cu interphase,its shape leeched on to Cu silk,number of layers,thickness of all layers and monolayer gradually increased with heating temperature enhanced and holding time prolonged.Its thickness was 93μm,a layer was towards Cu with indention,there were two layers which located on one and the same zone and interveined each other with bamboo shoot shape,its structure was Cu/Cu4Ti/Cu2Ti/Cu3Ti2/Cu4Ti3 /CuTi/CuTi2 /Ti,which included all phases in Ti-Cu binary alloy phase diagram,moreover,the structure was consistent with sequence of each phase located Ti-Cu phase diagram after dealed with heating temperature 700℃and holding time 100 hours.The forming of Ti/Cu diffusion-solution zone was resulted from diffusion,dissolve and crystal of Ti and Cu under the condition of solid phase.