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Design and simulation of a novel flip-chip structure for THz detector package
Authors:Hao  Haidong  Tang  Zhen  Lu  Hongda  Cheng  Lifeng  Lv  Xin
Affiliation:1.School of Information and Electronic, Beijing Institute of Technology University, Beijing, 100081, People’s Republic of China
;2.Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), Beijing, 100029, People’s Republic of China
;
Abstract:Microsystem Technologies - This work is intended to describe the design aspects and to characterize the functionality of a novel flip-chip (FC) structure applicable for THz camera assembling. The...
Keywords:
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