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Embedded passive components in advanced 3D chips and micro/nano electronic systems |
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| Authors: | Khan Muhammad Imran Dong Huang Shabbir Faisal Shoukat Rizwan |
| Affiliation: | 1.Department of Electronics Engineering, University of Engineering and Technology (UET), Taxila, 47050, Pakistan ;2.Micro-/Nano Electronic System Integration R&D Center (MESIC), University of Science and Technology of China (USTC), Hefei, 230027, Anhui, China ;3.School of Electronics Engineering, Xi’an University of Posts and Telecommunications, Xi’an, 710121, China ;4.Department of Civil and Environmental Engineering, The University of Auckland, Auckland, New Zealand ;5.Department of Civil Engineering, University of Engineering and Technology (UET), Taxila, 47050, Pakistan ;6.Department of Microsystems Engineering, IMTEK, University of Freiburg, Freiburg, 79110, Germany ; |
| Abstract: | Microsystem Technologies - Electronic devices are shrinking day by day, while the speed and reliability is increasing. At the same time, IC designs and micro/nano electronic systems are becoming... |
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