Status of LWIR HgCdTe-on-Silicon FPA Technology |
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Authors: | M. Carmody J.G. Pasko D. Edwall E. Piquette M. Kangas S. Freeman J. Arias R. Jacobs W. Mason A. Stoltz Y. Chen N.K. Dhar |
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Affiliation: | (1) Teledyne Imaging Sensors, 5212 Verdugo Way, Camarillo, CA 93012, USA;(2) US Army RDECOM CERDEC NVESD, Ft. Belvoir, VA 22060-5806, USA;(3) Army Research Laboratory, 2800 Powder Mill Road, Adelphi, MD 20783-1197, USA |
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Abstract: | The use of silicon as an alternative substrate to bulk CdZnTe for epitaxial growth of HgCdTe for infrared detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low-defect-density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for long-wavelength infrared (LWIR) HgCdTe detectors where the performance can be limited by the high (∼5 × 106 cm−2) dislocation density typically found in HgCdTe grown on silicon. The current status of LWIR (9 μm to 11 μm at 78 K) HgCdTe on silicon focal-plane arrays (FPAs) is reviewed. Recent progress is covered including improvements in noise equivalent differential temperature (NEDT) and array operability. NEDT of <25 mK and NEDT operability >99% are highlighted for 640 × 480 pixel, 20-μm-pitch FPAs. |
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Keywords: | MBE HgCdTe silicon FPA infrared LWIR |
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