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| 日本封装材料用环氧树脂动向 | |
| 引用本文： | 伍敏扬. 日本封装材料用环氧树脂动向[J]. 化工新型材料, 1999, 0(3) |
| 作者姓名： | 伍敏扬 |
| 作者单位： | 岳阳石油化工总厂技开处 |
| 摘 要： | 论述了日本封装材料用环氧树脂需求趋势，介绍了最近开发的高耐热性、耐湿性、低粘度环氧树脂。 |
| 关 键 词： | 环氧树脂 电子设备 封装材料 |
TREND OF EPOXY RESIN FOR POTTING MATERIALS IN JAPAN |
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| Wu Minyang. TREND OF EPOXY RESIN FOR POTTING MATERIALS IN JAPAN[J]. New Chemical Materials, 1999, 0(3) | |
| Authors: | Wu Minyang |
| Abstract: | Demand and Developing trend of Epoxy Resin for potting materials were reviewed.Epoxy Resin of High-heat Resistance,water-vapor Resistance,Low-viscosity in Recent Development were Introduced. |
| Keywords: | epoxy resin electronics potting materials |
| 本文献已被 CNKI 等数据库收录！ | |