Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads |
| |
| Authors: | Hui Xu Changqing Liu Vadim V. Silberschmidt Zhong Chen Jun Wei |
| |
| Affiliation: | 1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742, USA;2. Former Student, Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20740, USA;3. ON Semiconductor, 5005 East McDowell Rd, Phoenix, Arizona 85008, USA;1. Department of Advanced Materials Science and Engineering, Kangwon National University, Chuncheon, 24341, Republic of Korea;2. Heesung Metal, Namdong-daero, Namdong-gu, Incheon 21697, Republic of Korea;3. Xilinx Inc., Logic Drive, San Jose, CA 95124, USA |
| |
| Abstract: | The morphological features of lift-off footprints on the aluminium metallization pads were investigated to gain an understanding of the effects of bonding parameters on formation of initial bonds during thermosonic gold ball bonding. The obtained results showed that metallurgical bonding initiated at the peripheral areas of the contact area situated along the direction of ultrasonic vibration. Those areas extended inwards with an increase in ultrasonic power. Both the external bonded area and central non-bonded area increased with increasing bonding force. Based on the evolution of footprints, the bonding models were proposed, and the effects of the bonding parameters on the formation of initial bonds were discussed. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
