| 倒装芯片衬底粘接材料对大功率LED热特性的影响 |
| |
| 引用本文： | 余彬海,李绪锋.倒装芯片衬底粘接材料对大功率LED热特性的影响[J].半导体技术,2005,30(6):49-51,55. |
| |
| 作者姓名： | 余彬海 李绪锋 |
| |
| 作者单位： | 广东佛山市国星光电科技有限公司,广东,佛山,528000;广东佛山市国星光电科技有限公司,广东,佛山,528000 |
| |
| 基金项目： | 国家高技术研究发展计划(863计划) |
| |
| 摘 要： | 针对倒装芯片(Flipchip)大功率发光二极管器件,描述了大功率LED器件的热阻特性,建立了Flipchip衬底粘接材料的厚度和热导系数与粘接材料热阻的关系曲线,以三类典型粘接材料为例计算了不同厚度下的热阻,得出了Flipchip衬底粘接材料选择的不同对大功率LED的热阻存在较大影响的结论.
|
| 关 键 词： | 倒装芯片 粘接材料 大功率LED 热阻码 |
| 文章编号： | 1003-353X(2005)06-0049-03 |
Impact of Flipchip Substrate Adhesive on the Thermal Characteristic of High Power LED |
| |
| YU Bin-hai,LI Xu-feng.Impact of Flipchip Substrate Adhesive on the Thermal Characteristic of High Power LED[J].Semiconductor Technology,2005,30(6):49-51,55. |
| |
| Authors: | YU Bin-hai LI Xu-feng |
| |
| Abstract: | The thermal resistance characteristic of high power LED devices is described according to the flipchip high power LED. The equations of adhesive thermal resistance with thickness, thermal conductivity of adhesive of flipchip substrate are established. The conclusion that the different adhesives between flipchip substrate and LED slug with strong impact on the thermal resistance of high power LED devices is deduced after the thermal resistance of different thickness is calculated by taking three kinds of typical adhesives. |
| |
| Keywords: | flipchip adhesive high power LED thermal resistance |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
