Reliability of lead-free solder joints in CSP device under thermal cycling |
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| Authors: | Liang Zhang Lei Sun Yong-huan Guo Cheng-wen He |
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| Affiliation: | 1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China
2. Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA
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| Abstract: | Finite element method and Garofalo–Arrheninus creep model were combined and used to evaluate the reliability of different lead-free solder joints (SnAgCu, SnAg, SnSb and SnZn) and SnPb solder joints in chip scale package (CSP) 14 × 14 device under thermal cyclic loading. The results show that von Mises stress and equivalent creep strain in each of the four lead-free solder joints and SnPb solder joints were strongly different, increasing in the order SnPb < SnAg < SnSb < SnZn < SnAgCu. It is found that maximum stress–strain concentrates on the top-surface of corner solder joints in the CSP device for all solder joints, and SnAgCu solder joints shows the highest fatigue life among those five kinds of solder joints. |
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