星载电子设备散热凸台设计与返修方法

针对星载电子设备热设计中导热垫选型困难和散热凸台设计复杂的现状，文中以某星载数据处理器为例提出了一种高效的散热凸台设计及返修方法。通过分析导热垫厚度与接触热阻的关系以及导热垫压缩量与接触压力的关系，确定了导热垫的选型和散热凸台的结构设计方案。通过热仿真分析，证明了该方案在热设计上的合理性。经过导热垫试装及工装检验，验证了设备180余处散热凸台二次返修后安装0.5 mm厚GapPad3000S30型导热垫的匹配性，证明了该散热凸台设计及返修方法的合理性和高效性。该方法在研制热耗较大、散热器件较多的星载电子设备中具有很高的工程实用价值。

Design and Repair Method of Cooling Block in Space Electronic Devices

Aiming at the difficulty of thermal pad selection and complex cooling block designs, an efficient design and repair method for cooling blocks in the thermal design of spaceborne electronic devices is proposed in this paper, taking a spaceborne data processor as an example. The thermal pad selection and cooling block structural design scheme are determined by analyzing the relationship between the thermal pad thickness and thermal contact resistance as well as the relationship between the thermal pad compression and contact pressure. The rationality of the thermal design is verified through thermal simulation analysis. Through trial installation validation with thermal pads, it is verified that after the secondary repair of over 180 cooling blocks in the equipment, the matching of installing 0.5 mm GapPad3000S30 thermal pads is ensured. This verifies the suitability and efficiency of the cooling block design and repair method. This method has significant engineering practical value in the development of spaceborne electronic devices with high heat consumption and multiple heat-dissipating components.