Protecting and preserving clear barrier layers for flexible packaging materials In‐line thermal evaporation of organic topcoat layer |
| |
Authors: | Dr Antje Titzmann Alexander Wolff Gerd Hoffmann Dr Roland Trassl |
| |
Affiliation: | Applied Materials Web Coating GmbH, R&D PVD and Packaging Processes, Siemensstrasse 100, 63755 Alzenau |
| |
Abstract: | The end market for transparent flexible barrier films is larger than for metallized films. Presently, the market is still dominated by polymeric barrier layers but the used chemicals may be harmful for the environment. An alternative would be transparent thin layers deposited by vacuum deposition techniques using reactive processes. Ceramic materials like silicon oxide or aluminum oxide are used having a film thickness of just ~10 nm, a coating uniformity of +/?5% across and along the film at a barrier performance below 2.0 sccm/m2d for oxygen transmission rate (OTR) and below 1.0 g/m2d for water vapor transmission rate (WVTR) on PET substrates. In this paper, details will be provided about the deposition processes for these barrier layers using thermal evaporation, plasma‐assisted thermal evaporation as well as deposition by electron beam evaporation. An important factor for these high barrier transparent coatings is also to withstand the downstream processes in the whole packaging stream like slitting, lamination, printing etc. One solution is to protect the barrier layers by a Topcoat. For example, off‐line deposition of lacquers is used in field but the market penetration is low due to high process and material costs. An in‐situ Topcoat deposition is a smart solution to overcome this issue saving time and costs. Such an approach will be also described in the presentation and the impact on the performance of the final package will be discussed. |
| |
Keywords: | |
|
|