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Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material
Affiliation:1. Nano-Optoelectronics Research Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Minden, Penang, Malaysia;2. OSRAM Opto Semiconductors GmbH, Leibnizstraße 4, 93055 Regensburg, Germany;3. OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Bayan Lepas Free Industrial Zone Phase 1, 11900 Bayan Lepas, Penang, Malaysia;1. Department of Mechanical Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China;2. Department of Chemistry, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China;1. College of Environmental and Energy Engineering, Beijing University of Technology, Beijing 100022, China;2. Tangshan College, Tangshan 063000, Hebei Province, China;1. Korea Institute of Materials Science (KIMS), #797 Changwondaero, Changwon, Kyungnam 641-010, South Korea;2. Changwon National University, #9 Sarimdong, Changwon, Kyungnam 641-773, South Korea;1. Department of Clinical Pharmacy, School of Pharmacy, College of Pharmacy, Taipei Medical University, Taipei, 110, Taiwan;2. Department of Green Material Technology, Green Technology Research Institute, CPC Corporation, Kaohsiung 81126, Taiwan;3. Department of Mechanical and Automation Engineering, I-Shou University, Kaohsiung 84001, Taiwan;4. Department of Science Education, National Taipei University of Education, Taipei 106, Taiwan;5. Department of Materials Engineering, Ming Chi University of Technology, New Taipei City 24301, Taiwan;1. School of Mechanical and Power Engineering, Shanghai Jiaotong University, No. 800 Dongchuan Road, Shanghai 200240, China;2. School of Petroleum Engineering, Changzhou University, Changzhou, Jiangsu 213164, China;3. Beijing Fangda Research Institute, China
Abstract:This paper elucidates the thermal behavior of an LED employing metal filled polymer matrix as thermal interface material (TIM) for an enhanced heat dissipation characteristic. Highly thermal conductive aluminum (Al) particles were incorporated in bisphenol A diglycidylether (DGEBA) epoxy matrix to study the effect of filler to polymer ratio on the thermal performance of high power LEDs. The curing behavior of DGEBA was studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The dispersion nature of the Al fillers in polymer matrix was verified with Field Emission Scanning Electron Microscope (FESEM). The thermal performance of synthesized Al filled polymer composite as TIM was tested with an LED employing thermal transient measurement technique. Comparing the filler to polymer ratio, the rise in junction temperature for 60 wt% Al filled composite was higher by 11.1 °C than 50 wt% Al filled composite at cured state. Observed also from the structure function analysis that the total thermal resistance was 10.96 K/W higher for 60 wt% Al filled composite compared to 50 wt% Al filled composite. On the other hand, a significant rise of 9.5 °C in the junction temperature between cured and uncured samples of 50 wt% Al filled polymer TIM was observed and hence the importance of curing process of metal filled polymer composite for effective heat dissipation is discussed extensively in this work.
Keywords:Filler dispersion  Silane pre-treatment  Thermal interface material  Light emitting diode  Thermal transient measurement  Optical properties
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