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| 无铅钎料用无VOC助焊剂活化组分研究 | |
| 引用本文： | 张冰冰,雷永平,徐冬霞,李国伟,夏志东. 无铅钎料用无VOC助焊剂活化组分研究[J]. 电子元件与材料, 2008, 27(1): 16-19 |
| 作者姓名： | 张冰冰 雷永平 徐冬霞 李国伟 夏志东 |
| 作者单位： | 北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022 |
| 基金项目： | 国家科技支撑重点项目 , 北京市教委科研项目 , 国家高技术研究发展计划(863计划) |
| 摘 要： | 对无铅钎料免清洗助焊剂用各类活化剂性能及机理进行了分析,通过润湿力研究选择出活化性能较好的丁二酸和戊二酸以及一种羟基酸。以此活化组分为基础配制了两种无挥发性有机化合物(VOC)免清洗助焊剂,并且根据SJ/T 11273—2002《免清洗液态助焊剂》的规定对该助焊剂进行了性能检测。结果表明,两种助焊剂无松香无卤素,固体含量低,润湿力大,腐蚀性小,扩展率达75%,助焊性能良好,可应用到无铅波峰焊中。 |
| 关 键 词： | 电子技术 无铅焊料 无VOC助焊剂 活化剂 |
| 文章编号： | 1001-2028（2008）01-0016-04 |
| 收稿时间： | 2007-09-14 |
| 修稿时间： | 2007-09-14 |
Study on a VOC-free flux for lead-free solder |
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| ZHANG Bing-bing,LEI Yong-ping,XU Dong-xia,LI Guo-wei,XIA Zhi-dong. Study on a VOC-free flux for lead-free solder[J]. Electronic Components & Materials, 2008, 27(1): 16-19 | |
| Authors: | ZHANG Bing-bing LEI Yong-ping XU Dong-xia LI Guo-wei XIA Zhi-dong |
| Affiliation: | ZHANG Bing-bing,LEI Yong-ping,XU Dong-xia,LI Guo-wei,XIA Zhi-dong(Laboratory of Advanced Electronic Joining Materials,Beijing University of Technology,Beijing 100022,China) |
| Abstract: | The performance and mechanism of different kinds of activators which were used in VOC-free flux for lead-free solder were investigated. Butane diacid, pentane diacid and one hydroxyl acid were chosen as organic activators which had good behavior in wetting experiment. Two new VOC-free fluxes were prepared with these activators, and the performance tests were implemented according to the industry standard of SJ/T 11273-2002. The results show that two new VOC-free fluxes contained these activators are of rosin-free, halogen-free, lower solid content, higher wetting force, and less corrosivity and spread tote 75% which can meet the requirement of lead-free solder. They are promising to be utilized in lead-free wave-soldering. |
| Keywords: | electron technology lead-free solder VOC-free flux activator |
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