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| 印制板化学镀镍 | |
| 引用本文： | 蔡积庆. 印制板化学镀镍[J]. 表面技术, 1994, 23(1): 31-33 |
| 作者姓名： | 蔡积庆 |
| 作者单位： | 南京无线电八厂 |
| 摘 要： | 介绍了采用金属Zn粒子悬浮液活化要镀镍的印制板(PCB)Cu电路表面,使其可以进行化学镀镍的工艺方法,它可以克服Pd-Sn活化的缺点. |
| 关 键 词： | 印制板 活化剂 镀镍 化学镀 |
A Process of Electroless Nickel Plating for Printed Circuit Boards |
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| Cai Jiqing. A Process of Electroless Nickel Plating for Printed Circuit Boards[J]. Surface Technology, 1994, 23(1): 31-33 | |
| Authors: | Cai Jiqing |
| Affiliation: | Nanjing No. 8 Radio Plant |
| Abstract: | The copper circuitry surfaces of printed circuit boards (PCB) which will be electrolessly nickel plated are activated by aqueous suspension of particulate zinc metal, and then the electroless nickel plating is carried out. By so doing the disadvantages in Pd-Sn activation are overcomed. |
| Keywords: | printed circuit board activator electroless nickel plating |
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