透明材料微小器件键合质量检测系统设计

针对材料和结构均特殊的透明材料微小器件的键合质量检测,提出了可见光透射机器视觉检测法。分析了检测系统硬件中主要部件的性能要求,研究了该检测系统的图像处理技术。检测系统利用光源、相机、镜头和计算机等主要部件实现图像采集功能,并通过图像相减、灰度直方图调整、图像滤波和图像二值化等图像处理功能来完成质量检测。实验结果表明,提出的可见光透射机器视觉检测法能灵敏有效地检测出透明材料微小器件键合位置处存在的键合间隙和缺陷大小,检测精度可达10 μm,满足透明材料微小器件键合质量的要求,是一种高效、非接触、无损、无污染的检测方法。

Design of bonding quality testing system for micro device made of transparent materials

A visible light transmittance machine vision detection method was put forward to measure the bonding quality of micro devices made by transparent materials with specific compositions and structures. The performance requirements of main components in the system hardware was analyzed, and the image processing techniques for the detection system were researched. The visible light transmittance machine vision detection system captured the image with the main components of the light source, camera, lens and the computer and implemented quality testing by image subtraction, gray histogram adjustment, image filtering and image binarization. Experimental results indicate that the proposed detection method can detect the bonding gaps of the micro devices made by transparent materials sensitively and effectively, and the detection accuracy of flaw size is about 10 μm. The results meet the detection requirements of micro devices for bonding quality and verify that the method is efficient, non-contact, non-destructive and non-polluting.