ChCl-urea-ZnO-Cu2O低共熔溶剂电镀铜锌合金

以ChCl-urea-ZnO-Cu₂O低共熔溶剂为电解质在343 K镍基体上电沉积制备得到了铜锌合金镀层。伏安曲线测试表明在沉积过程中，镍基体能够诱导金属Zn发生欠电位沉积，从而实现了Cu-Zn合金的共沉积。同时研究了沉积电势对镀层成分和形貌的影响，结果表明：沉积电势由-0.85 V （vs Ag）增加到-1.3 V （vs Ag）时，合金镀层中Zn原子百分数从0升高到76.29%。在沉积电势为-1.10～-1.15 V范围内，Zn原子百分数为12.5%～20.81%时，镀层平整致密，颜色为金色，达到仿金镀的效果。

Electroplating of Zn-Cu alloys in ChCl-urea-ZnO-Cu2O deep eutectic solvents

Cu-Zn alloy was electrodeposited on nickel substrate in ChCl-urea-ZnO-Cu₂O deep eutectic solvents at 343 K. The voltammetric curve test shows that cluring the deposition process, the nickel matrix can induce the underpotential deposition of the metallic Zn, thus achieving the co-deposition of the Cu-Zn alloy. The effects of deposition potential on composition, surface and morphology of Cu-Zn alloy coatings were also studied. The results indicate that when deposition potential negatively shifts from -0.85 V(vs Ag) to -1.30 V (vs Ag), the Zn content in the alloy increases from 0 to 76.29%(atom). When deposition potential is located in the range of -1.10——1.15 V, the content of Zn is in the range of 12.5%(atom)-20.81%(atom), the alloy coating is golden. Thus, the imitating Gold plating can be achieved in ChCl-urea-ZnO-Cu₂O deep eutectic solvents by controlling a suitable deposition potential.