| 从专利文献看键合铜丝的发展 |
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| 引用本文： | 禹建敏,邓 超,李双燕,杨正雄,毛 勇.从专利文献看键合铜丝的发展[J].云南冶金,2013(3):51-55,58. |
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| 作者姓名： | 禹建敏 邓 超 李双燕 杨正雄 毛 勇 |
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| 作者单位： | [1]云南大学材料科学与工程系,云南昆明650091 [2]云南铜业科技发展股份有限公司,云南昆明650101 |
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| 摘 要： | 随着当今微电子器件日趋小型化、高性能化的特点以及国家节能减排、降本增效的发展要求，键合铜丝将逐步取代键合金丝成为微电子封装用主流键合材料。本文根据键合铜丝专利文献综述了键合铜丝的发展现状，介绍了键合铜丝的微合金化研究动向，指出键合铜丝的研究重点是通过最佳微合金元素设计和微合金化工艺控制来提高铜丝的强度、键合性能与可靠性。
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| 关 键 词： | 键合铜丝 微合金化 专利 |
| 收稿时间： | 2012/9/1 0:00:00 |
The Development of Copper Bonding Wire from the Patent Literature |
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| YU Jianming,DENG Chao,LI Shuangyan,YANG Zhengxiong and MAO Yong.The Development of Copper Bonding Wire from the Patent Literature[J].Yunnan Metallurgy,2013(3):51-55,58. |
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| Authors: | YU Jianming DENG Chao LI Shuangyan YANG Zhengxiong and MAO Yong |
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| Affiliation: | 1. Material Science and Engineering Faculty, Yunnan University, Kunming, Yunnan 650091, China; Yunnan Copper Science ＆ Technology Development Limited Company, Kunming, Yunnan 650101, China) |
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| Abstract: | Copper bonding wire will gradually replace gold bonding wire to be the main bonding material in microelectronics en- capsulation along with todayg microelectronic device miniaturization and high performance featuies with each passing day, and the following national requirements： energy saving and emission reduction, reducing costs and increasing benefits. The present development of copper bonding wires is summarized according to the patent literature, and the microalloying study trend of copper bonding wire is also introduced in this paper; the research emphasis of copper bonding wire is pointed out that the improvement of copper wire＇s strength, bonding performance and reliability shall be achieved by the optimum mieroalloying elements design and microalloying technology controlling. |
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| Keywords: | copper bonding wire microalloying patent |
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