Nanoindentation and AFM studies of PECVD DLC and reactively sputtered Ti containing carbon films |
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Authors: | A Pauschitz J Schalko T Koch C Eisenmenger-Sittner S Kvasnica Manish Roy |
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Affiliation: | (1) Austrian Centre of Competence for Tribology, Viktor Kaplan-Straβe 2, A 2700 Wiener Neustadt, Austria;(2) Defence Metallurgical Research Laboratory, 500 058 Hyderabad, India;(3) Institute of Industrial Electronics and Material Science, Vienna University of Technology, A 1040 Vienna, Austria;(4) Institute of Material Science and Testing, Vienna University of Technology, A 1040 Vienna, Austria;(5) Institute of Solid State Physics, Vienna University of Technology, A 1040 Vienna, Austria;(6) Boltzman Institute of Biomedical Microtechnology, Vienna University of Technology, A 1040 Vienna, Austria |
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Abstract: | Amorphous carbon film, bdalso known as DLC film, bdis a promising material for tribological application. It is noted that
properties relevant to tribological application change significantly depending on the method of preparation of these films.
These properties are also altered by the composition of the films. In view of this, bdthe objective of the present work is
to compare the nanoindentation and atomic force microscopy (AFM) study of diamond like carbon (DLC) film obtained by plasma
enhanced chemical vapour deposition (bdPECVD with the Ti containing amorphous carbon (Ti/a- C : H) film obtained by unbalanced magnetron sputter deposition (UMSD). Towards that purpose, DLC and Ti/a- C : H films are deposited on silicon substrate by PECVD and UMSD processes, respectively. The microstructural features and
the mechanical properties of these films are evaluated by scanning electron microscopy (SEM), bdtransmission electron microscopy
(TEM), nanoindentation and by AFM. The results show that the PECVD DLC film has a higher elastic modulus, hardness and roughness
than the UMSD Ti/a- C : H film. It also has a lower pull off force than Ti containing amorphous carbon film. |
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Keywords: | Carbon films nanoindentatio topography |
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