高性能计算机组装结构分析

由于科学研究和商业应用对高性能计算机的需求与日俱增，高性能计算机的性能在向E级扩展，计算性能的提高带来了占地面积的提高。急剧增长的占地面积限制了高性能计算机的设计和使用，使得高密度组装技术也成为计算领域一个不可忽视的关键技术。本文根据高性能计算机的计算插件及背板的组装结构设计，提出将高性能计算机的组装结构分为四类。针对TOP500榜单前十名系统的组装结构参数，对各种组装结构进行了分析。指出随着芯片性能的提高，液冷散热技术的广泛使用和技术的成熟，有背板双面组装结构可以有效提高组装密度。

Assembly Structure Analysis of High Performance Computer

Due to the increasing demand for high performance computing in scientific research and commercial applications, the performance of high-performance computers is expanding to E-class, and the increase in computing performance has brought about an increase in floor space. The rapidly increasing footprint limits the design and use of high-performance computers, making high-density assembly technology a key technology that can not be ignored in the computing field. Based on the design of the assembly structure of the computing plug-in and the backplane of the high-performance computer, this paper proposes to divide the assembly structure of the high-performance computer into four categories. According to the assembly structure parameters of top ten systems in Top500 List, various assembly structures are analyzed. It is pointed out that with the improvement of chip performance, the widespread use of liquid cooling technology and the maturity of liquid cooling technology, the double-sided assembly structure with backplane can effectively increase the assembly density.