Fracture phenomenology of a sintered silicon nitride containing oxide additives

Crack propagation mechanisms in a sintered silicon nitride containing various oxide additives (ceria, magnesia, zirconia and strontium oxide) were studied as a function of initial flaw size, temperature, applied stress and time. Surface cracks of controlled size were introduced using the microhardness indentation-induced-flaw technique. At 20° C, the fracture stress was found to depend on initial crack size according to the Griffith relationship and extrapolation of the data indicated that processing flaws of 20 to 35 were strength-controlling. The flexural strength was found to be independent of temperature from 20 to 800° C and the mode of crack propagation was primarily transgranular. At temperatures above 800° C the flexural strength decreased significantly, due to viscous flow of the glassy phase present in the material and resulting in sub-critical crack growth (SCG). The mode of crack propagation during SCG was essentially intergranular. Flexural stress-rupture evaluation in the temperature range 800 to 1000° C has identified the stress levels for time-dependent and time-independent failures.