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电铸铜制备小直径薄壁回转体零件
引用本文:赵勇飞,钱双庆,章勇,张华,陈文龙.电铸铜制备小直径薄壁回转体零件[J].电镀与涂饰,2020(8):456-460.
作者姓名:赵勇飞  钱双庆  章勇  张华  陈文龙
作者单位:南通大学机械工程学院;沙洲职业工学院;江苏江华阀业有限公司
基金项目:国家自然科学青年基金(51305212);江苏高校“青蓝工程”资助(苏教师[2017]15号)。
摘    要:采用3D打印的圆柱体作为芯模电铸铜,得到小直径薄壁回转体零件。配方和工艺条件为:CuSO4·5H2O 200 g/L,浓硫酸60 g/L,Cl-0.05 g/L,pH 1,温度26℃,极间距3 cm,电流密度2~8 A/dm2,阴极表面线速率3.14~12.56 mm/s。研究了电流密度和阴极表面线速率对电铸铜表面形貌和显微硬度的影响。随电流密度或阴极表面线速率增大,电铸铜的晶粒得到有效细化,组织更均匀、致密,显微硬度先增大后减小。电流密度为4A/dm2,阴极表面线速率为9.42 mm/s时,电铸铜的表面形貌最好,显微硬度最高,所得回转体零件表面光滑、平整,厚度均匀。

关 键 词:电铸铜  回转体  三维打印  电流密度  阴极表面线速率  形貌  显微硬度

Preparation of thin-walled rotary parts with a small diameter by copper electroforming
ZHAO Yongfei,QIAN Shuangqing,ZHANG Yong,ZHANG Hua,CHEN Wenlong.Preparation of thin-walled rotary parts with a small diameter by copper electroforming[J].Electroplating & Finishing,2020(8):456-460.
Authors:ZHAO Yongfei  QIAN Shuangqing  ZHANG Yong  ZHANG Hua  CHEN Wenlong
Affiliation:(School of Mechanical Engineering,Nantong University,Nantong 226019,China)
Abstract:A thin-walled rotary part with a small diameter was obtained by copper electroforming on 3D printed cylinder substrate from the bath containing CuSO4·5 H2O 200 g/L,concentrated sulfuric acid 60 g/L,and Cl-0.05 g/L at pH 1,temperature 26℃,electrode spacing 3 cm,current density 2-8 A/dm2,and linear rate of cathode surface 3.14-12.56 mm/s.The effects of current density and linear rate of cathode surface on the surface morphology and microhardness of the electroformed copper were studied.With the increasing of current density or linear rate of cathode surface,the grains of electroformed copper were refined,its microstructures were more uniform and compact,and its microhardness was increased initially and then decreased.The copper electroformed at a current density of 4 A/dm2 and a linear rate of 9.42 mm/s for cathode surface had the best surface morphology and highest microhardness,and the rotary parts obtained were smooth and level with an uniform distribution of thickness.
Keywords:copper electroforming  rotary body  three-dimensional printing  current density  linear rate of cathode surface  morphology  microhardness
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