Passive and Active Reduction Techniques for On-Chip High-Frequency Digital Power Supply Noise

Signal integrity has become a major problem in digital IC design. One cause is device scaling that results in a sharp reduction of supply voltage, creating stringent noise margin requirements to ensure functionality. This paper introduces both a novel on-chip decoupling capacitance methodology and active noise cancellation (ANC) structure. The decoupling methodology focuses on quantification and location. The ANC structure, with an area of 50 $mu {hbox {m}} times,55 mu{hbox {m}}$, uses decoupling capacitance to sense noise and inject a proportional current into $V _{rm SS}$ as a method of reduction. A chip has been designed and fabricated using TSMC's 90-nm technology. Measurements show that the decoupling methodology improved the average voltage headroom loss by 17% while the ANC structure improved the average voltage headroom loss by 18%.