| Ti-Cu复合中间层在钨/CLAM钢扩散连接中的性能 |
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| 引用本文： | 陈柏炎,李先芬,王成,王春艳,孙晨曦,李颖芝.Ti-Cu复合中间层在钨/CLAM钢扩散连接中的性能[J].金属功能材料,2021,28(1):65-72. |
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| 作者姓名： | 陈柏炎 李先芬 王成 王春艳 孙晨曦 李颖芝 |
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| 作者单位： | 合肥工业大学材料科学与工程学院,安徽合肥230009;合肥工业大学材料科学与工程学院,安徽合肥230009;合肥工业大学材料科学与工程学院,安徽合肥230009;合肥工业大学材料科学与工程学院,安徽合肥230009;合肥工业大学材料科学与工程学院,安徽合肥230009;合肥工业大学材料科学与工程学院,安徽合肥230009 |
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| 基金项目： | 合肥工业大学2019年省级大学生创新创业训练计划项目资助 |
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| 摘 要： | 采用Ti-Cu复合中间层扩散连接钨与CLAM钢,在30 MPa、1h和800~950℃的条件下,成功获得了W/Ti-Cu/CLAM钢接头。接头界面连接良好,中间层区域发现有Ti2Cu或TiCu4等金属间化合物产生。TiC脆硬层使得中间层/钢界面处的硬度远高于钢母材,同时造成了接头处钢母材的失C并软化现象。随焊接温度的升高,接头的剪切强度先升高后降低,在850℃时达到了274 MPa的最大值,剪切试样均断裂在W/中间层界面靠近钨侧处。
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| 关 键 词： | 扩散焊 钨 CLAM钢 复合中间层 金属间化合物 |
Performance of W/CLAM steel diffusion bonding with Ti-Cu mixed powder interlayer |
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| CHEN Boyan,LI Xianfen,WANG Cheng,WANG Chunyan,SUN Chenxi,LI Yingzhi.Performance of W/CLAM steel diffusion bonding with Ti-Cu mixed powder interlayer[J].Metallic Functional Materials,2021,28(1):65-72. |
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| Authors: | CHEN Boyan LI Xianfen WANG Cheng WANG Chunyan SUN Chenxi LI Yingzhi |
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| Affiliation: | (School of Material Science and Engineering,HeFei University of Technology,HeFei 230009,Anhui,China) |
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| Abstract: | W and CLAM steel with Ti-Cu mixed powder interlayer was diffusion bonded successfully at 30 MPa,1 h and 800~950℃.The appearance of W/Ti-Cu/CLAM steel joints were good.Ti2Cu or TiCu4 intermetallic compounds were found in the Ti-Cu mixed powder interlayer.The hardness of interlayer/CLAM steel interface was much higher than that of the base metal due to the formation of TiC,this brittle phase of TiC also resulted in the softened of steel.With the rising of joining temperature,the shear strength of the joint increased firstly and then decreased,and reached the maximum value of 274 MPa at 850℃.All the specimens in shear test fractured at the interface of W/interlayer near the W substrate. |
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| Keywords: | diffusion bonding tungsten CLAM steel mixed powder interlayer intermetallics |
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