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铈对镀锡引线可焊性的影响
引用本文:宣天鹏,王翔通.铈对镀锡引线可焊性的影响[J].电镀与精饰,1993,15(5):11-13.
作者姓名:宣天鹏  王翔通
作者单位:合肥工业大学,安徽师范大学 230009
摘    要:探讨了稀土元素铈对电子元器件引线镀锡层可焊性的影响。结果表明,在氟硼酸盐镀锡溶液中加入适量的铈能提高镀液的稳定性,镀层的抗氧化性和可焊性,并可获得更为光亮的镀层。

关 键 词:器件引线  镀锡  

Effect of Cerium on Solderability of Tin Coating on Electronic Component Lead
Xuan Tianpeng and Wang Xiangtong.Effect of Cerium on Solderability of Tin Coating on Electronic Component Lead[J].Plating & Finishing,1993,15(5):11-13.
Authors:Xuan Tianpeng and Wang Xiangtong
Affiliation:Xuan Tianpeng and Wang Xiangtong
Abstract:Effect of cerium on solderability of tin coating on electronic component lead was studied. The results show that when a proper amount of cerium is added in the fluoborate tin plating bath, the stability of the bath, oxidation resistance and solderability of the coating can be in- creased. And the brightness of the coating can be improved further.
Keywords:electronic component lead  tin plating  cerium
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