|
|||||
|
|
Foreword |
|
| Authors: | James P. Lucas Srini Chada Sung K. Kang C. Robert Kao Kwang-Lung Lin Jud Ready Jin Yu |
| Affiliation: | (1) Chemical Engineering & Materials Science, Michigan State University, East Lansing, MI;(2) Honeywell Electronic Materials, 99216 Spokane, WA;(3) IBM T.J. Watson Research Center, 10598 Yorktown Heights, NY;(4) Department of Chemical Engineering, National Central University, Chungli City, Taiwan;(5) Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan;(6) MicroCoating Technologies, 30341 Atlanta, GA;(7) Center for Electronic Packaging KAIST, Korea |
| Abstract: | |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |