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| 用于微电子组装的导电胶粘接剂的研究现状 | |
| 引用本文： | 鲜飞. 用于微电子组装的导电胶粘接剂的研究现状[J]. 印制电路信息, 2006, 0(3): 68-70 |
| 作者姓名： | 鲜飞 |
| 作者单位： | 烽火通信科技股份有限公司,430074 |
| 摘 要： | 综述了当前电子组装业中导电胶粘接剂的研究情况,主要介绍国外正在重点研究的几大类导电胶粘接剂及其组成,与传统锡铅焊料的对比,以及它们的电性能、机械性能、热性能等,并简要介绍其发展趋势。 |
| 关 键 词： | 导电胶粘接剂 电子组装 研究现状 |
Study Situation of Conductive Adhesives for Microelectronics Packing |
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| Xian Fei. Study Situation of Conductive Adhesives for Microelectronics Packing[J]. Printed Circuit Information, 2006, 0(3): 68-70 | |
| Authors: | Xian Fei |
| Abstract: | This paper introduces the study situation of conductive adhesives for microelectronics packing. Several typical conductive adhesives are focused on,more attention is paid to their components,electrical performance,mechanical performance,thermal performance, and as replacement of conventional tin-lead solder, com- parison between them is carried on. The development trend is also briefly reviewed. |
| Keywords: | conductive adhesives microelectronics packing study situation |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |