基于ANSYS的大功率半导体光放大器的热分析

功率型半导体光放大器（High-Power Semiconductor Optical Amplifier,以下简称HP-SOA）在长距离自由空间光通信等领域有着诱人的应用前景,1550nm波段高速、大功率光源的需求日益增加,促进了HP-SOA技术的发展。随着输出功率的提高,HP-SOA热耗散功率也随之增加,其热特性对器件性能影响日趋明显,需及时散热。因此散热问题的解决是一个很关键的技术,高效率的器件散热结构设计十分必要。文章利用ANSYS有限元分析软件对输出光功率26dBm的大功率SOA器件的温度场分布进行了模拟和优化设计,为SOA封装材料、工艺方案的选择提供了依据,并据此进行了封装实验。

Thermal Analysis of High-power Semiconductor Optical Amplifiers Based on ANSYS

The HP-SOA has a promising future in long-distance free-space optical communications. With the growing demand of high-speed and high power light source of 1 550nm wavelength, the development of HP-SOA technology is accelerated. Heat increases going with the higher the output power, need to be dissipated in time. Because thermal characteristic has a tremendous impact on the performance, it’s a key technology to dissipate the thermal. And it’s necessary to design the heat dissipation devices with good efficiency. ANSYS is applied for the temperature distribution simulation and optimization of HP-SOA with 26dBm out-put power, it provides a guidance to choose appropriate packaging materials and process, and the experience has been done against the results.