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Self‐Assembled On‐Chip‐Integrated Giant Magneto‐Impedance Sensorics
Authors:Daniil Karnaushenko  Dmitriy D Karnaushenko  Denys Makarov  Stefan Baunack  Rudolf Schäfer  Oliver G Schmidt
Affiliation:1. Institute for Integrative Nanosciences, Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), Dresden, Germany;2. Institute for Metallic Materials, Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), Dresden, Germany;3. Institute for Materials Science, Dresden University of Technology, Dresden, Germany;4. Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz, Germany;5. Center for Advancing Electronics Dresden, Dresden University of Technology, Dresden, Germany
Abstract:
Keywords:flexible electronics  magnetic field sensors  magneto‐impedance  self‐assembly  strain engineering
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