新一代层叠封装(PoP)的发展趋势及翘曲控制

便携式移动设备是当今半导体集成电路行业的主要发展动力。其对封装的挑战,除电性能的提高外,还强调了小型化和薄型化。层叠封装(PoP)新的趋势,包括芯片尺寸增大、倒装技术应用、超薄化等,进一步增加了控制封装翘曲的难度。超薄封装的翘曲大小及方向与芯片尺寸、基板和塑封层厚度,以及材料特性密切相关。传统的通用封装方案已不再适用,需要根据芯片设计及应用,对封装设计、材料等因素加以优化,才能满足翘曲控制要求。另外,基板变薄后,来自不同供应商的基板可能出现不同的封装翘曲反应,需要加强对基板设计公差及供应链的管控。

Trends for the Next Generation of PoP Package and Its Warpage Control

As the ICs designed for mobile applications become the new growth driver for semiconductor industry, Package-on-Package （ PoP ） is transitioning to the next generation, such as the Through-Mold-Via （ TMV ） technology, to address new challenges. In addition to electrical performance enhancement, reduction in package size, especially in thickness, becomes very important. However, thin package makes the warpage increase significantly, and may cause solder joint opening failure in the PoP stack assembly. Warpage has since become one of the key challenges as package becomes thinner and thinner. For thin package, warpage is highly dependent on die size, stack thickness, and the properties of the materials used. Package design and material selection must be customized to specific die and application. The traditional one-for-all solution is no longer applicable. Furthermore, data shows that, as substrates become thin, substrates sourced from different suppliers may cause significant package warpage variation. As a result, thin PoP should apply better control over design tolerance and supplier chain management.