| PCB塞孔问题探讨 |
| |
| 引用本文： | 陈拥军,杨司进,梁滢.PCB塞孔问题探讨[J].印制电路信息,2012(8):26-29. |
| |
| 作者姓名： | 陈拥军 杨司进 梁滢 |
| |
| 作者单位： | 微软亚洲硬件中心,广东深圳,518057 |
| |
| 摘 要： | PCB板面小孔塞孔是当今流行的PCB设计方法,其目的是确保制作完成的PCB能顺利完成在OEM制造工厂的制造与功能测试流程,本文通过对PCB塞孔后出现的比较重大的品质问题以及解决方案来阐述如何在PCB制作工厂进行有效的小孔塞孔品质控制.
|
| 关 键 词： | PCB塞孔 导通孔油墨裂缝 三机作业 ICT测试 |
The study on PCB via hole plugging |
| |
| CHEN Yong-Jun
,
YANG Si-Jing
,
LIANG Ying.The study on PCB via hole plugging[J].Printed Circuit Information,2012(8):26-29. |
| |
| Authors: | CHEN Yong-Jun YANG Si-Jing LIANG Ying |
| |
| Affiliation: | CHEN Yong-Jun YANG Si-Jing LIANG Ying |
| |
| Abstract: | The PCB via hole plugging is the popular design in PCB design industry,and the purpose is to make sure the board can complete subsequent assembly & test process in OEM factory.Here we analyzed the quality issue on via hole plugging and provided solution for the issue,which is to give a guideline on how to achieve the effective via hole plugging control for PCB factory. |
| |
| Keywords: | PCB VIA hole plugging via hole solder mask cracking stuff 3 times ICT test |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
