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Reliability study of industry Sn3.0Ag0.5Cu/Cu lead-free soldered joints in electronic packaging |
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| Authors: | Lei Sun Liang Zhang Su-juan Zhong Jia Ma Li Bao |
| Affiliation: | 1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China 2. State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China |
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