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Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging |
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| Authors: | R W Wu L C Tsao R S Chen |
| Affiliation: | 1. Department of Engineering Science, National Cheng Kung University, Tainan, 701, Taiwan 2. Institute of Materials Engineering, National Pingtung University of Science and Technology, Neipu, 91201, Pingtung, Taiwan |
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