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Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints |
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| Authors: | G. Q. Wei L. C. Du Y. P. Jia L. Qi |
| Affiliation: | 1. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, 510640, People’s Republic of China |
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