| 硬质合金刀具材料化学机械抛光机理研究 |
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| 引用本文： | 袁巨龙,毛美姣,李敏,刘舜,胡自化,吴锋.硬质合金刀具材料化学机械抛光机理研究[J].表面技术,2019,48(2):260-267. |
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| 作者姓名： | 袁巨龙 毛美姣 李敏 刘舜 胡自化 吴锋 |
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| 作者单位： | 湖南大学 国家高效磨削工程技术研究中心,长沙 410082;湖南科技大学 难加工材料 高效精密加工湖南省重点实验室,湖南 湘潭 411201;浙江工业大学 特种装备制造与 先进加工技术教育部重点实验室,杭州 310014;湖南大学 国家高效磨削工程技术研究中心,长沙 410082;湘潭大学 复杂轨迹加工工艺及 装备教育部工程研究中心,湖南 湘潭 411105;湘潭大学 复杂轨迹加工工艺及 装备教育部工程研究中心,湖南 湘潭,411105 |
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| 基金项目： | 国家自然科学基金（51605163）；湖南省自然科学基金（2017JJ4055）；湖南省科技厅科技计划重点研发项目（2016GK2014，2017GK2050） |
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| 摘 要： | 目的研究硬质合金刀具材料化学机械抛光(CMP)机理,为改善硬质合金刀具表面质量提供理论支持。方法分析硬质合金刀具材料在酸性抛光液中的化学反应,研究硬质合金刀具材料CMP的化学反应机理。基于接触力学理论计算抛光垫与工件的实际接触面积和单个磨粒的实际切削面积,在运动学分析的基础上,建立硬质合金刀具材料CMP的材料去除率模型,通过实验验证材料去除率模型的有效性。结果在酸性抛光液中,硬质合金被氧化成Co_3O_4。当工件、抛光垫、磨粒类型、工件安装位置确定时,材料去除率与抛光载荷、磨粒浓度和抛光盘转速有关。常用硬质合金抛光条件下,抛光YG8刀具的修正系数Kcm为8.53,抛光后刀具的最低表面粗糙度能达到48nm,材料去除率为62.381nm/min,材料去除率的理论值和实验值的最大相对误差为13.25%,消除了表面缺陷,获得了较好的镜面效果。结论建立的材料去除率模型具有一定的有效性,对硬质合金刀具材料进行化学机械抛光能消除刀具的表面缺陷,改善表面质量。
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| 关 键 词： | 硬质合金刀具 化学机械抛光 机理 化学反应 运动轨迹 材料去除率 |
| 收稿时间： | 2018/10/25 0:00:00 |
| 修稿时间： | 2019/2/20 0:00:00 |
Chemical and Mechanical Polishing Mechanism of Cemented Carbide Tool Material |
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| YUAN Ju-long,MAO Mei-jiao,LI Min,LIU Shun,HU Zi-hua and WU Feng.Chemical and Mechanical Polishing Mechanism of Cemented Carbide Tool Material[J].Surface Technology,2019,48(2):260-267. |
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| Authors: | YUAN Ju-long MAO Mei-jiao LI Min LIU Shun HU Zi-hua and WU Feng |
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| Affiliation: | 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China; 2.Hunan Provincial Key Laboratory of High Efficiency and Precision Machining for Difficult-to-Cut Material, Hunan University of Science and Technology, Xiangtan 411201, China; 3.Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou 310014, China,1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China; 4.Engineering Research Center of Complex Tracks Processing Technology and Equipment of Ministry of Education, Xiangtan University, Xiangtan 411105, China,1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China; 2.Hunan Provincial Key Laboratory of High Efficiency and Precision Machining for Difficult-to-Cut Material, Hunan University of Science and Technology, Xiangtan 411201, China; 3.Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of Ministry of Education, Zhejiang University of Technology, Hangzhou 310014, China,4.Engineering Research Center of Complex Tracks Processing Technology and Equipment of Ministry of Education, Xiangtan University, Xiangtan 411105, China,4.Engineering Research Center of Complex Tracks Processing Technology and Equipment of Ministry of Education, Xiangtan University, Xiangtan 411105, China and 4.Engineering Research Center of Complex Tracks Processing Technology and Equipment of Ministry of Education, Xiangtan University, Xiangtan 411105, China |
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| Abstract: | The work aims to study the chemical and mechanical polishing (CMP) mechanism of cemented carbide tool ma-terial, so as to provide theoretical support for improving the surface quality of cemented carbide tool. The chemical reaction of cemented carbide tool material in acid polishing solution was analyzed and the chemical reaction mechanism of cemented carbide tool material CMP was studied. The actual contact area between polishing pad and workpiece and the actual cutting area of a single abrasive particle were calculated based on contact mechanics theory, the material removal rate model of cemented carbide tool material CMP was established on the basis of kinematics analysis, and the effectiveness of the material removal rate model was verified by experiments. In acid polishing solution, cemented carbide tool was oxidized to Co3O4. When the workpiece, polishing pad, abrasive particle type and installation position were determined, the material removal rate was related to polishing load, abrasive particle concentration and polishing disc speed. The correction coefficient Kcmwas 8.53 for the YG8 tools CMP under common cemented carbide polishing conditions, and the lowest surface roughness of the polished tools could reach 48 nm. At this time, the material removal rate was 62.381 nm/min and the maximum relative error between the theoretical value and the experimental value of material removal rate was 13.25%. Thus, surface defects were eliminated and good mirror effect was obtained. The material removal rate model is effective certainly, and CMP of cemented carbide tool material can eliminate the surface defects of the tool and improve surface quality. |
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| Keywords: | cemented carbide tool Chemical Mechanical Polishing mechanism chemical reaction motion trajectory material removal rates |
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