| 添加剂对镀锡引线可焊性的影响 |
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| 引用本文： | 宣天鹏,刘玉.添加剂对镀锡引线可焊性的影响[J].电镀与精饰,1996,18(5):11-14. |
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| 作者姓名： | 宣天鹏 刘玉 |
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| 作者单位： | 合肥工业大学 |
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| 摘 要： | 分析了镀暗锡和光亮镀锡引线的可焊性，讨论了添加剂对镀锡引线可焊性的影响，适量的添加剂能提高引线的平整性和可焊性，获得了具有良好可焊性所需的最佳添加剂的加入量。
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| 关 键 词： | 镀锡 可焊性 电镀 助剂 电子引线 |
Effect of Additives on the Solderability of Tin Coated Lead |
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| Xuan Tianpeng and Liu Yu.Effect of Additives on the Solderability of Tin Coated Lead[J].Plating & Finishing,1996,18(5):11-14. |
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| Authors: | Xuan Tianpeng and Liu Yu |
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| Affiliation: | Hefei University of Technology |
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| Abstract: | The solderability of electronic component lead by mat and bright tin plating analysed. Effect of additives on solderability of tin coated lead is studied. When a proper amount of additives is added into tin plating bath, smoothness and solderability of tin coated lead are increased. The optimum additives quantity for obtaining desirable solderability of electronic component lead is present in the paper. |
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| Keywords: | additive electronic component lead tin plating solderability |
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