Molecular Dynamics Simulation of Flattening Process of a High-Temperature, High-Speed Droplet—Influence of Impact Parameters |
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Authors: | J Shimizu E Ohmura Y Kobayashi S Kiyoshima H Eda |
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Affiliation: | (1) Department of Intelligent Systems Engineering, Ibaraki University, Hitachi, Ibaraki, Japan;(2) Graduate School, Osaka University, Suita, Osaka, Japan;(3) Tocalo Co., Ltd., Akashi, Hyogo, Japan;(4) Research Center of Computational Mechanics, Inc., Shinagawa, Tokyo, Japan |
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Abstract: | Three-dimensional molecular dynamics simulation was conducted to clarify at an atomic level the flattening process of a high-temperature
droplet impacting a substrate at high speed. The droplet and the substrate were assumed to consist of pure aluminum, and the
Morse potential was postulated between a pair of aluminum atoms. In this report, the influence of the impact parameters such
as the droplet velocity and the droplet diameter on flattening behavior were analyzed. As a result, the following representative
conclusions were obtained: (a) the flattening ratio increases in proportion to the droplet velocity and the droplet diameter;
(b) the flattening ratio for nanosized droplet can be reorganized by the same dimensionless parameters of the proper physical
properties, such as the viscosity and the surface tension, as those used in the macroscopic flattening process.
This article is an invited paper selected from presentations at the 2007 International Thermal Spray Conference and has been
expanded from the original presentation. It is simultaneously published in Global Coating Solutions, Proceedings of the 2007 International Thermal Spray Conference, Beijing, China, May 14-16, 2007, Basil R. Marple, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain
Montavon, Ed., ASM International, Materials Park, OH, 2007. |
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Keywords: | droplet flattening impact parameter molecular dynamics solidification |
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