大直径太阳能硅片高效低损耗线切割技术研究

随着太阳能电池对大直径硅片的需求不断增加,大尺寸超薄硅片多线切割技术的发展趋势将日益明显。传统的外圆和内圆切割已经不能满足现有硅片大尺寸、小切缝、高质量和高效率的要求。本文对硅片切割方法、游离磨料多线切割基本原理、线切割硅片材料去除机理以及切割工艺因素进行了综述。

The Research of Higher Efficiency and Lower Loss Wire-saw Technology of the Large Diameter Solar Silicon Wafer

With the increasing demand for solar battery on large diameter silicon wafers, the development of multi-wire-saw technology of large-size, ultra-thin wafers will become increasingly apparent. The traditional outer diameter and inner diameter cutter can not meet the requirement of the large size, small kerr-loss, high quality and high efficiency of silicon wafer slicing. Silicon wafer cutting method, the basic principle of free abrasive multi-wire-saw, material removal mechanism of multi-wire-saw and the cutting process factors are introduced.