| 提高导电胶性能的研究进展 |
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| 引用本文： | 秦云川,齐暑华,杨永清,张翼.提高导电胶性能的研究进展[J].中国胶粘剂,2011,20(9). |
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| 作者姓名： | 秦云川 齐暑华 杨永清 张翼 |
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| 作者单位： | 西北工业大学理学院应用化学系,陕西西安,710129 |
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| 摘 要： | 导电胶作为一种新型的绿色微电子封装互连材料,其应用范围越来越广,并且其代替传统的Pb-Sn焊料已成为必然趋势。介绍了导电胶的研究应用现状,总结了导电胶的优点及存在的问题。综述了近几年来在提高导电胶的电导率、接触电阻稳定性以及力学性能等方面的研究进展,并展望了导电胶未来的发展方向。
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| 关 键 词： | 导电胶 体积电阻率 接触电阻 力学性能 |
Research progress of improving ECA's properties |
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| Qin Yunchuan,Qi Shuhua,Yang Yongqing,Zhang Yi.Research progress of improving ECA's properties[J].China Adhesives,2011,20(9). |
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| Authors: | Qin Yunchuan Qi Shuhua Yang Yongqing Zhang Yi |
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| Affiliation: | Qin Yunchuan,Qi Shuhua,Yang Yongqing,Zhang Yi(Department of Applied Chemistry,College of Science,Northwestern Polytechnical University,Xi'an 710129,China) |
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| Abstract: | The conductive adhesive(ECA),which was used as a new green microelectronic encapsulation interconnecting materials,had wider and wider application range,and the trend of traditional Pb-Sn solder replaced by ECA was inevitable.The ECA's actuality in research and applications was introduced,and the ECA's excellences and existent problems were summarized.The recent research progresses were also summarized in improving ECA's electrical conductivity,contact resistance stability,mechanical properties and other as... |
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| Keywords: | conductive adhesive(ECA) volume resistivity contact resistance mechanical property |
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