新型高效冷却热沉设计及其流体热力学模拟

为了满足高功率密度的激光二极管列阵叠层的封装需求，设计了新型小通道高效冷却热沉，并利用Ansys-Fluent软件模拟了它的热特性和冷却水的流动特性。相对于传统的宏通道热沉，小通道热沉的有效散热面积的增加大大提高了其散热效果。同样的散热需求下，小通道热沉所需冷却水水流流速更低，因此也就降低了对水冷机的水压要求。对于不同散热要求的高功率密度激光二极管叠层封装的热沉设计，可根据本文所述的流体热力学模拟方法及其详细的数据分析，对该类小通道热沉进行结构参数优化、热特性仿真及所需冷却水流速的预估。所设计的高效冷却小通道热沉结构具有加工简单，成本低，且方便耐用、寿命长等优点，是高功率密度激光二极管叠层器件封装的有效散热热沉结构。

Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks.Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software.Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks.Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced.Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime.This heat-sink is an ideal choice for the package of high power density laser diode array stacks.